Reflow soldering is a popular method in the electronics industry due to its high efficiency, automation possibility, and ability to achieve a high degree of accuracy and repeatability.
Remelting assembled printed circuits using a reflow oven is the basic method for mounting electronic components on printed circuits (PCB - Printed Circuit Board). The reflow oven uses high-temperature technology to remelt the solder and ensure a strong connection between the component and the PCB. The assembled PCBs are inserted into a reflow oven, which is designed to achieve precise temperature profiles that match the requirements of a specific type of solder.
We use two reflow ovens on our SMT lines: SEHO GoReflow 2.3 and HTS-0802-N
Another method we use to reflow assembled PCBs is vapour phase soldering on the Asscon VP 2000-400 machine. Vapour phase soldering, or condensation brazing, is a special technique used for precise and reliable soldering of electronic components to printed circuit boards (PCBs). In this technique, the solder paste is melted in vapour, allowing for more precise and consistent joints.
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